发明名称
摘要 This machining device (10), machining unit, and machining method radiate a laser at a workpiece (8), and perform cutting or boring machining of the workpiece (8). The present invention has: a laser output device (12); a guiding optical system (14) that guides a laser; and a radiating head (16) that guides the laser and radiates the laser to the workpiece (8). The radiating head (16) integrally rotates a first prism (52) and second prism (54) by means of a rotation mechanism, thereby rotating the light path of the laser around the rotational axis of the rotation mechanism and radiating while rotating the position of irradiation at the workpiece (8). A control device (22) calculates the permissible rotational frequency range of the laser on the basis of the relationship between the rotational frequency and allowed thickness of an oxide layer of the workpiece or the relationship between the rotational frequency and allowed thickness of a remelted layer of the workpiece (8), determines a rotational frequency contained in the permissible rotational frequency range as the rotational frequency of the rotation mechanism, and causes the rotation of the rotation mechanism at the determined rotational frequency, thus enabling high-precision machining by means of a simple configuration.
申请公布号 JP5189684(B1) 申请公布日期 2013.04.24
申请号 JP20120051023 申请日期 2012.03.07
申请人 发明人
分类号 B23K26/06;B23K26/073;B23K26/08;B23K26/38 主分类号 B23K26/06
代理机构 代理人
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