| 摘要 |
A light emitting device package and a method for manufacturing the same are provided. The light emitting device package comprises a package body (110) including a cavity (111) disposed at an upper portion. The light emitting device package includes an insulating layer (120,121) disposed on a surface of the package body. The light emitting device package includes a plurality of metal layers (140,141) disposed on the insulating layer. The light emitting device package includes a light emitting device (150) disposed in the cavity. The light emitting device package includes a first metal plate (145) disposed at a rear surface of the package body at a location corresponding to the light emitting device. |
