BONDED SUBSTRATE AND MANUFACTURING MOTHOD THEREOF

摘要

PURPOSE: A bonded substrate and a manufacturing method thereof are provided to remove the empty space between a first and a second substrate and improve the bonding quality of the first and the second substrate. CONSTITUTION: An ion is injected into a first substrate to form an ion implantation layer(S110). The first substrate is bonded to a second substrate having grooves(S120). The first substrate is separated based on the ion implantation layer(S130). The ion is hydrogen, helium, nitrogen, oxygen, or argon. [Reference numerals] (S110) Injecting ions into a first substrate; (S120) Bonding the first substrate to a second substrate having grooves; (S130) Separating the first substrate based on the ion implantation layer;