DIE STACK PACKAGE AND METHOD FOR FABRICATING THE SAME

摘要

PURPOSE: A die stack package and a manufacturing method thereof are provided to improve yield by preventing a package defect like a short circuit between wires. CONSTITUTION: First outer circuit patterns are formed on an insulation layer(10). A first solder mask(32) opens a part of a control chip land unit. A third solder mask layer covers the first solder mask. A control chip(50) is mounted on the control chip land unit. A bonding finger unit(25) is connected to the control chip by a bonding wire.