| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a ceramic wiring board and semiconductor module having a sufficient resistance to damages caused by heat shock, cooling cycle, etc. and a high reliability and a high connection reliability between electronic components and a metal circuit board. Ž<P>SOLUTION: The ceramic wiring board 1 consists of a ceramic substrate 11, the metal circuit board 12 which is formed of copper or a copper alloy mainly composed of copper and is joined to one surface of the ceramic substrate 11, and a metal heat sink 13 which is formed of copper of a copper alloy and is joined to the other surface of the ceramic substrate 11. The average grain diameter of recrystallized particles of the copper or the copper alloy of the metal circuit board 12 is equal to or smaller than that of recrystallized particles of the copper or the copper alloy of the metal heat sink 13. Ž<P>COPYRIGHT: (C)2007,JPO&INPIT Ž</p> |
