| 摘要 |
PURPOSE: A lighting module implementing method using a COB(Chip On Board) package and a lighting module thereof are provided to reduce a manufacturing method by implementing various shapes of lighting modules. CONSTITUTION: A COB package(110) is arranged on the upper surface of a substrate. Connection parts(121~123) are connected in one way between serial and parallel combinations. The connection is implemented according to the output specification of the multiple COB package modules. The substrate comprises a metal core PCB. The COB package mixes a single chip with a multichip. |
