发明名称 METAL FOIL LAMINATE, SUBSTRATE FOR MOUNTING LED, AND LIGHT SOURCE DEVICE
摘要 <p>Provided is a metal foil laminate that: has heat resistance; has high reflectance in the visible light range; has little decrease in reflectance in environments with a high-temperature thermal load; is compatible with large surface areas; and can be used for printed circuit boards for mounting LEDs that have excellent adhesion with metals. The metal foil laminate is characterized in that: a laminate has metal foil on at least one side of a resin layer (A) containing a polyorganosiloxane and an inorganic filler; the 90° peel strength between said resin layer (A) and said metal foil is at least 0.95 kN/m, and the mean reflectance at wavelengths of 400 to 800 nm on the surface that is exposed when the resin layer (A) is exposed by peeling and removing said metal foil is at least 80%; and the decrease in the reflectance at a wavelength of 470 nm after being treated with heat for 10 minutes at 260° C. is not more than 5%.</p>
申请公布号 KR20130041315(A) 申请公布日期 2013.04.24
申请号 KR20137005946 申请日期 2011.07.26
申请人 MITSUBISHI PLASTICS, INC. 发明人 MATSUI JUN;TERAI TOMOHIKO;SUZUKI SYUUJI
分类号 G02B5/08;F21V7/22;H01L33/60;H05K1/03 主分类号 G02B5/08
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