| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which is excellent in reliability when being made to be a package, under such a circumstance that the reliability of the package becomes insufficient owing to the peeling-off of a laminated insulating film in a packaging process, or after packaging, being consequent upon high integration with a multilayered wiring structure. Ž<P>SOLUTION: The semiconductor device has a semiconductor element and a laminated body provided in the one face of the semiconductor element, wherein the laminated body has a resin layer constituted by a resin composition including a compound having a cage structure, a first junction layer joined to a face closer to the semiconductor element of the resin layer, and a second junction layer joined to another face of the resin layer. In addition, when the adhesive force between the resin layer and the first junction layer is set to A, and the adhesive force between the resin layer and the second junction layer is set to B, the relation to become A/B=0.5-3.0 is satisfied. Ž<P>COPYRIGHT: (C)2009,JPO&INPIT Ž |
