Encapsulating sheet and optical semiconductor element device

摘要

An encapsulating sheet (7) is formed from an encapsulating resin composition which contains an encapsulating resin and silicone microparticles, wherein the mixing ratio of the silicone microparticles with respect to the encapsulating resin composition is 20 to 50 mass %. An optical semiconductor element device comprises an optical semiconductor element (11) and an encapsulating resin layer (7) which is formed from the encapsulating sheet and encapsulates the optical semiconductor element.