| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method for manufacturing highly reliable semiconductor device without any change in the manufacturing process of the related art, and also to provide a bonding sheet used in the same method and a semiconductor device attained with the same method.SOLUTION: The semiconductor device manufacturing method comprises a temporary fixing process for temporarily fixing a semiconductor element 13 on a fixing body 11 via a bonding sheet 12, a wire bonding process for wire bonding to the semiconductor element 13, and a sealing process to seal the semiconductor element 13 with a sealing resin 15. Loss elasticity at 175°C of the bonding sheet 12 is 2000 Pa or more. |
