发明名称 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION
摘要 PURPOSE: A positive photosensitive resin composition is provided to secure the high-sensitivity and high definition of the composition, to improve he residue elimination property, and to maintain the balance of a solid content of the composition. CONSTITUTION: A positive photosensitive resin composition contains a polybenzoxazole precursor including a recurring unit marked as chemical formula 1, a photosensitive diazoquinone compound, a silane compound, a phenol compound and a solvent. In the chemical formula 1, X1 refers to an aromatic organic group or a quadrivalent-hexavalent aliphatic organic group. X2 refers to the aromatic organic group. Y1 and Y2 are the aromatic organic group or a divalent-hexavalent aliphatic organic group, respectively.
申请公布号 KR101257696(B1) 申请公布日期 2013.04.24
申请号 KR20080111329 申请日期 2008.11.10
申请人 发明人
分类号 G03F7/039 主分类号 G03F7/039
代理机构 代理人
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