发明名称 |
HEAT-CURABLE SILICONE RESIN COMPOSITION, SILICONE RESIN-CONTAINING STRUCTURE, OPTICAL SEMICONDUCTOR ELEMENT SEALED BODY, AND SILANOL CONDENSATION CATALYST |
摘要 |
The purpose of the present invention is to provide a heat-curable silicone resin composition that has excellent heat curing properties and contains a lanthanoid compound. The heat-curable silicone resin composition contains an organo polysiloxane (A) with a silanol group, a silane compound (B) with an alkoxysilyl group, a lanthanoid compound (C), and a zinc compound (D). The amount of silane compound (B) is 0.5-2,000 parts by mass per 100 parts by mass of the organo polysiloxane (A); the amount of the lanthanoid compound (C) is 0.0001-1 parts by mass per 100 parts by mass total of the organo polysiloxane (A) and the silane compound (B); and the amount of the zinc compound (D) is 0.01-5 parts by mass per 100 parts by mass total of the organo polysiloxane (A) and the silane compound (B). |
申请公布号 |
KR20130040266(A) |
申请公布日期 |
2013.04.23 |
申请号 |
KR20137007656 |
申请日期 |
2011.11.09 |
申请人 |
THE YOKOHAMA RUBBER CO., LTD. |
发明人 |
TAKEI YOSHIHITO;ISHIKAWA KAZUNORI;SAIKI TAKEAKI |
分类号 |
C08L83/06;C08G77/08;C08K3/10;H01L23/29 |
主分类号 |
C08L83/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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