发明名称 |
Integrated circuit packaging system with a stack package and method of manufacture thereof |
摘要 |
A method of manufacture of an integrated circuit packaging system includes: providing a stack board; connecting a device over the stack board; forming a stack encapsulant having a cavity and a pedestal over the device and having a shaped perimeter side from a pedestal surface of the pedestal to the stack board; and attaching a stack adhesive to a base package and the pedestal, the cavity and the shaped perimeter side providing a space for connections to the stack board.
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申请公布号 |
US8426955(B2) |
申请公布日期 |
2013.04.23 |
申请号 |
US20090484158 |
申请日期 |
2009.06.12 |
申请人 |
CHI HEEJO;PARK YEONGIM;LEE HYUNGMIN;STATS CHIPPAC LTD. |
发明人 |
CHI HEEJO;PARK YEONGIM;LEE HYUNGMIN |
分类号 |
H01L23/28 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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