发明名称 Semiconductor device integrated with converter and package structure thereof
摘要 The present invention provides a semiconductor device including a semiconductor substrate having a first conductive type, at least one high-side transistor device and at least one low-side transistor device. The high-side transistor device includes a doped high-side base region having a second conductive type, a doped high-side source region having the first conductive type and a doped drain region having the first conductive type. The doped high-side base region is disposed within the semiconductor substrate, and the doped high-side source region and the doped drain region are disposed within the doped high-side base region. The doped high-side source region is electrically connected to the semiconductor substrate, and the semiconductor substrate is regarded as a drain of the low-side transistor device.
申请公布号 US8426914(B2) 申请公布日期 2013.04.23
申请号 US201113013832 申请日期 2011.01.26
申请人 LIN WEI-CHIEH;SINOPOWER SEMICONDUCTOR INC. 发明人 LIN WEI-CHIEH
分类号 H01L29/00 主分类号 H01L29/00
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