发明名称 |
Chip package structure and method for manufacturing the same |
摘要 |
A method for manufacturing a semiconductor package structure is disclosed. In one embodiment, the method includes the steps of forming a plurality of conductive pastes on a matrix lead frame with a groove located within a predetermined distance from each conductive paste on the lead; partially curing the conductive pastes so that the conductive pastes are in a semi-cured state; preparing at least one chip with a plurality of bumps thereon; electrically connecting the chip and the lead by implanting the bumps into the semi-cured conductive pastes, wherein the groove on the lead of the matrix lead frame is configured to receive overflowed semi-cured conductive pastes; curing the semi-cured conductive pastes to completely secure the bumped chip; and forming an encapsulating material covering the lead frame and the chip. The method can also be applied in pre-molded lead frame package. |
申请公布号 |
US8426255(B2) |
申请公布日期 |
2013.04.23 |
申请号 |
US201113232946 |
申请日期 |
2011.09.14 |
申请人 |
SHEN GENG-SHIN;CHIPMOS TECHNOLOGIES, INC. |
发明人 |
SHEN GENG-SHIN |
分类号 |
H01L21/44;H01L21/48;H01L21/50 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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