| 摘要 |
An exemplary image sensor module includes a plate, an image sensor, and a number of conductive wires. The plate includes a top surface, a bottom surface, an light passing through hole, and a number of conductive pads on the top surface. The sensor includes a first surface and a number of bonding pads corresponding to the respective conductive pads. The first surface opposes the bottom surface. The first surface includes a light sensitive region aligned with the through hole, and a light insensitive region surrounding the light sensitive region. The insensitive region is mounted on the bottom surface. The bonding pads are arranged on the light insensitive region. The wires pass through the light passing through hole, and respectively electrically connect the bonding pads to the corresponding conductive pads. |
