| 发明名称 |
Bonding apparatus, method for preventing dissolving of adhesive agent, and bonding method |
| 摘要 |
A bonding unit (20) bonding a wafer (12) and a support plate (14) with a mediation of an adhesive agent (16) to form a bonded substance (18), and a plasma treatment unit (22) treating the bonded substance (18) with a plasma treatment are provided. |
| 申请公布号 |
US8425713(B2) |
申请公布日期 |
2013.04.23 |
| 申请号 |
US20080451629 |
申请日期 |
2008.04.11 |
| 申请人 |
OHYA SATOSHI;MIYANARI ATSUSHI;TOKYO OHKA KOGYO CO., LTD. |
发明人 |
OHYA SATOSHI;MIYANARI ATSUSHI |
| 分类号 |
B32B38/00 |
主分类号 |
B32B38/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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