| 发明名称 |
Thermally sensitive material embedded in the substrate |
| 摘要 |
A structure and methods for using an integrated circuit structure comprise a substrate and circuitry connected to the substrate. The substrate includes a heat sensitive material that changes color when heated. The heat sensitive material has one of a plurality of colors depending upon a temperature to which the substrate was exposed. |
| 申请公布号 |
US8426856(B2) |
申请公布日期 |
2013.04.23 |
| 申请号 |
US20100834110 |
申请日期 |
2010.07.12 |
| 申请人 |
AYOTTE STEPHEN P.;HOLVERSON KRISTEN L.;SULLIVAN TIMOTHY M.;INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
AYOTTE STEPHEN P.;HOLVERSON KRISTEN L.;SULLIVAN TIMOTHY M. |
| 分类号 |
H01L23/34;H01L21/66 |
主分类号 |
H01L23/34 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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