CUTTING METHOD OF LIGHT EMITTING ELEMENT PACKAGE WITH CERAMIC SUBSTRATE AND CUTTING METHOD OF WORKPIECE WITH MULTI-LAYER STRUCTURE

摘要

PURPOSE: A method for cutting a light emitting device package by adopting a ceramic substrate and a method for cutting an object of a multilayer structure are provided to improve productivity by cutting a different material layer with a laser cutting process after a material layer which is unsuitable for a laser cutting process is removed by a mechanical cutting device. CONSTITUTION: A plurality of light emitting device chips(20) are mounted on a surface of a ceramic substrate(10). A transmissive material layer(30) which covers the plurality of light emitting device chips is formed. The transmissive material layer between the plurality of light emitting device chips is removed along a preset cut line by a mechanical cutting method. The ceramic substrate is cut along the preset cut line by a laser cutting method and is separated into an individual light emitting device package. The laser cutting method is a full-cutting method to cut the ceramic substrate by irradiating high output laser beams to the ceramic substrate.