| 摘要 |
An LED(light emitting diode) lamp and a backlight unit including the same are provided to reduce a heat radiating path by forming a separate heat radiation lead line and improve a reflection characteristic by coating the surfaces of first and second packages and the surface of a printed circuit board with white. An optical lens(42) has a shell shape to surround an LED chip. An anode lead line(43) and a cathode lead line(44) are connected to both ends of the LED chip, respectively. At least one heat radiation lead lines(45,46,47,48) are formed at a side connected to the anode lead line and/or the cathode lead line. A package(41) surrounds the side surface of the LED chip and is formed partially to surround the anode lead line, the cathode lead line and the heat radiation lead lines. |
