APPARATUS AND METHOD FOR REMOVING PATICLES OF SEMICONDUCTOR CHIP

摘要

PURPOSE: An apparatus and a method for removing particles of a semiconductor chip are provided to remove the particles by using an adhesive tape and to prevent the damage of the semiconductor chip. CONSTITUTION: A supply unit(200) supplies an adhesive tape(100) to the upper surface of a semiconductor chip(11). The supply unit includes a release roller(220) for winding the adhesive tape and a traction roller(210) for pulling the adhesive tape. A pressurization unit(300) attaches the adhesive tape on the surface of the semiconductor chip. The pressurization unit includes a pressure roller(310) and a pressure roller driver(320) for moving the pressure roller along the surface of the semiconductor chip. A transfer unit(400) moves the adhesive tape on the semiconductor chip.