A die that includes a substrate having a first and second major surface is disclosed. The die has at least one unfilled through via passing through the major surfaces of the substrate. The unfilled through via serves as a vent to release pressure generated during assembly.
申请公布号
US8426246(B2)
申请公布日期
2013.04.23
申请号
US201213400578
申请日期
2012.02.21
申请人
TOH CHIN HOCK;LIU HAO;KOLAN RAVI KANTH;UNITED TEST AND ASSEMBLY CENTER LTD.