发明名称 Spin coating modeling
摘要 A method for setting processing parameters for fabricating an integrated circuit, by creating a mathematical model of a spin coated surface of a material over a non-flat substrate surface, where the mathematical model includes, a smoothing algorithm, where the smoothing algorithm uses as inputs only, a nominal thickness of the spin coated surface, a minimum thickness of the spin coated surface, and an interaction length, and a constraint that the spin coated surface cannot intersect the substrate surface, solving the mathematical model to determine the spin coated surface, and using the modeled spin coated surface to set the processing parameters for fabricating the integrated circuit.
申请公布号 US8428762(B2) 申请公布日期 2013.04.23
申请号 US20100855124 申请日期 2010.08.12
申请人 GRAVES JOHN S.;SMITH MARK D.;ROBERTSON STEWART A.;KLA-TENCOR CORPORATION 发明人 GRAVES JOHN S.;SMITH MARK D.;ROBERTSON STEWART A.
分类号 G06F19/00 主分类号 G06F19/00
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