| 摘要 |
PURPOSE: A high power LED light source module, a backlight unit and a lighting device including the same are provided to implement platform of a lighting module by applying the light source parts of various kinds on one base substrate. CONSTITUTION: A ceramic substrate(200) is adhered to the inside of a base substrate(100). A wire(203) is connected between the pad of the ceramic substrate and the base substrate. The base substrate includes an MC(Metal Core) PCB. The ceramic substrate comprises a COB(Chip on Board) package. The ceramic substrate is adhered with a heat radiation adhesive(220). |
