| 摘要 |
Disclosed is a surface-treated metal foil which can be produced at low cost and enables easy formation of an extremely thin electroless plated copper foil, which does not require a sputtering process for forming a fine circuit and is capable of maintaining high adhesion strength, on a substrate surface. The surface-treated metal foil can provide a replica having a uniform roughening shape with an anchoring effect. Specifically disclosed is a surface-treated metal foil, wherein a roughening bump plating is formed on at least one surface of an untreated metal foil using a burnt plating, and the roughening bump plating is subjected to capsule plating. The surface-treated metal foil has a surface roughness (Rz) of 1.0-2.5 µm. The roughening bumps formed in the roughening bump plating have a columnar shape with an interval of not less than 0.1 µm but not more than 1.0 µm between adjacent roughening bumps. The surface-treated metal foil is most suited for the use as a replica. The surface-treated metal foil is preferably a copper foil. |
