Semiconductor chip mounting system

摘要

A circuit chip mounting system incorporates a carrier having a socket for receiving a circuit chip. The socket includes a plurality of contacts for contacting pads on the chip and includes pins extending therefrom for insertion into terminals in a PCB. Secondary spacers each having a configuration corresponding to a portion of the shape of the carrier are provided with holes arranged to receive the pins and permit the pins to pass therethrough for insertion in PCB terminals. The secondary spacers are soluble to be removed in a washing procedure during processing.