| 摘要 |
The present invention provides a chip part manufacturing method comprising a separating process capable of suppressing deformation of chip parts, and also provides chip parts. It comprises a step of forming a plurality of frame-like void portions (32) in one main surface of substrate (30) and insulating resin layer (20) having a spiral void portion (40) disposed in the region thereof, a step of forming metal layer (36) in frame-like void portion (32) and spiral void portion (40) and on insulating resin layer (20), a step of polishing metal layer (36) at least up to the upper surface of insulating resin layer and forming coil section (18) in spiral void portion (40), and a step of forming a metal layer for connecting chip parts to frame-like void portion (32), wherein the metal layer is melted and removed by using an etching agent to separate a plurality of chip parts connected to each other by a frame-like connection. |
