| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor package manufacturing method which can prevent performance deterioration caused by invasion by a foreign substance between a substrate and an encapsulation material or into a substrate. <P>SOLUTION: A semiconductor package manufacturing method of manufacturing a semiconductor package by using, in a semiconductor manufacturing process, a grip ring 1 gripping a peripheral edge of a pressure-sensitive adhesive sheet 4 between an inner ring 2 and an outer ring 3, the method comprises: arranging on a surface of the pressure-sensitive adhesive sheet 4, a plurality of intermediate assemblies 25 for the semiconductor package in which a semiconductor chip 22 is mounted on a multilayered substrate 20 at intervals so as to be held by adhesion; integrally molding the plurality of intermediate assemblies 25 by a mold resin 26 to cover a region other than an undersurface 27 of each intermediate assembly 25; and removing the integrally molded plurality of intermediate assemblies 25 from the grip ring 1, and subsequently, dividing the integrally molded plurality of intermediate assemblies 25 between the intermediate assembly 25 and the intermediate assembly 25 adjacent to each other. <P>COPYRIGHT: (C)2013,JPO&INPIT |
