发明名称 CHIP TYPE ELECTRONIC COMPONENT AND MOUNTING STRUCTURE OF CHIP TYPE ELECTRONIC COMPONENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a chip type electronic component capable of achieving reduction in internal stress in a terminal electrode, prevention of solder corrosion, and reduction in contact resistance, and to provide a mounting structure using the chip type electronic component. <P>SOLUTION: A terminal electrode 3 in a multilayered capacitor 1 has a first resin electrode layer 3a containing Ni powder coated by Cu adjacent to the inside of an Sn-plating layer 3b as the outermost layer. Ni powder contained in this first resin electrode layer 3a is coated by Cu. The first resin electrode layer may contain Cu powder. A second resin electrode layer containing Ni powder coated by Sn may be used as the outermost layer. The terminal electrode does not have an Ni-plating layer. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013073952(A) 申请公布日期 2013.04.22
申请号 JP20110209659 申请日期 2011.09.26
申请人 TDK CORP 发明人 TOGASHI MASAAKI
分类号 H01G4/30;H01G4/232;H01G4/252 主分类号 H01G4/30
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