| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board meeting a requirement of improving electrical reliability, and a packaging structure of the wiring board. <P>SOLUTION: A wiring board 4 according to an embodiment of the present invention includes: a substrate 7; a through hole T penetrating through the substrate 7 in the thickness direction; and a through hole conductor 8 covering an inner wall of the through hole T. The substrate 7 includes a plurality of glass fibers 12 and a resin 10 disposed between the glass fibers 12. The glass fibers 12 have a groove-like recessed part C on a surface exposed to the inner wall of the through hole T, and a part of the through hole conductor 8 is filled in the recessed part C. <P>COPYRIGHT: (C)2013,JPO&INPIT |
