| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive tape for working a brittle wafer, which enables working of a thin-filmed brittle wafer in a process for grinding a rear surface of the wafer by sticking the pressure-sensitive adhesive tape to a circuit surface of the brittle wafer so as to fix and support the same, and a method for grinding a rear surface of a sapphire wafer. <P>SOLUTION: The pressure-sensitive adhesive tape for working a brittle wafer has a radiation-curable, pressure-sensitive adhesive layer on a base resin film. The pressure-sensitive adhesive layer of the pressure-sensitive adhesive tape prior to radiation curing shows an adhesive force of 2.0-29.8 N/25 mm against a mirror surface of a silicon wafer, a surface of the pressure-sensitive adhesive layer shows an angle of contact with pure water of ≥85°, and the pressure-sensitive tape prior to radiation curing exhibits compressive displacement of ≤150 μm. The method for grinding uses the same. <P>COPYRIGHT: (C)2013,JPO&INPIT |
