| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a circuit board for mounting electronic component elements which allows for thinning of a package while reducing the material cost and minimizing generation of foreign matters, and to provide a manufacturing method therefor. <P>SOLUTION: The circuit board for mounting electronic component elements includes a wiring board having internal connection terminals provided on one surface, external connection terminals provided on the other surface, and interlayer connections for electrically connecting these connection terminals, a cavity layer with an opening placed on the one surface of the wiring board with an adhesive layer interposed therebetween, and a lid substrate placed on the cavity layer so as to close the opening with an adhesive layer interposed therebetween. The cavity layer is formed of a base material not having a reinforcement material. <P>COPYRIGHT: (C)2013,JPO&INPIT |
