发明名称 |
LASER BEAM MACHINING APPARATUS |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a laser beam machining apparatus capable of machining a printed board of high quality by preventing an irradiation mark from remaining on a workpiece when it is re-irradiated with reflecting laser beams reflected on the workpiece. <P>SOLUTION: A machining head 25<SB POS="POST">1</SB>having a galvano scanner 2 and an fθ lens 5 is provided with a shielding plate 26<SB POS="POST">1</SB>of high laser beam absorptance, and the shielding plate 26<SB POS="POST">1</SB>absorbs the reflecting laser beams 9 reflected on the workpiece W. <P>COPYRIGHT: (C)2013,JPO&INPIT |
申请公布号 |
JP2013071136(A) |
申请公布日期 |
2013.04.22 |
申请号 |
JP20110210494 |
申请日期 |
2011.09.27 |
申请人 |
HITACHI VIA MECHANICS LTD |
发明人 |
SASAKI TOMOYUKI;KASE MOTOYUKI |
分类号 |
B23K26/06;B23K26/00;B23K26/08;G02B26/10 |
主分类号 |
B23K26/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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