发明名称 LASER BEAM MACHINING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a laser beam machining apparatus capable of machining a printed board of high quality by preventing an irradiation mark from remaining on a workpiece when it is re-irradiated with reflecting laser beams reflected on the workpiece. <P>SOLUTION: A machining head 25<SB POS="POST">1</SB>having a galvano scanner 2 and an f&theta; lens 5 is provided with a shielding plate 26<SB POS="POST">1</SB>of high laser beam absorptance, and the shielding plate 26<SB POS="POST">1</SB>absorbs the reflecting laser beams 9 reflected on the workpiece W. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013071136(A) 申请公布日期 2013.04.22
申请号 JP20110210494 申请日期 2011.09.27
申请人 HITACHI VIA MECHANICS LTD 发明人 SASAKI TOMOYUKI;KASE MOTOYUKI
分类号 B23K26/06;B23K26/00;B23K26/08;G02B26/10 主分类号 B23K26/06
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