发明名称 ELECTRONIC COMPONENT MOUNTING APPARATUS, ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD
摘要 PURPOSE: An electronic component mounting apparatus, an electronic component mounting system, and an electronic component mounting method are provided to control an electronic component supply device with a plurality of lanes corresponding to a component tape to maintain the electronic component. CONSTITUTION: An electronic component supply unit(14) includes a first supply device(30) and a second supply device(32). The first supply device includes a plurality of lanes(31). The plurality of lanes supply an electronic component maintaining member to maintain a plurality of electronic components(9). The second supply device includes a singular lane. A head(15) mounts the electronic component supplied from the first supply device on a substrate(8). The control device controls the electronic component supply unit based on errors of the lane.
申请公布号 KR20130039692(A) 申请公布日期 2013.04.22
申请号 KR20120112580 申请日期 2012.10.10
申请人 JUKI CORPORATION 发明人 ATSUMI TADASHI
分类号 H05K13/04;H05K13/02 主分类号 H05K13/04
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