发明名称 COMPOUND SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a compound semiconductor device and a manufacturing method of the same, which can achieve normally-off operation while inhibiting current collapse. <P>SOLUTION: A compound semiconductor device of an embodiment comprises: a substrate 1; a compound semiconductor laminate structure 7 formed above the substrate 1; and a gate electrode 11g, a source electrode 11s and a drain electrode 11d which are formed above the compound semiconductor laminate structure. The compound semiconductor laminate structure 7 includes a nitride semiconductor layer including an electron transit layer 3 and an electron supply layer 5 formed above the electrode transit layer 3. An In composition of a surface of the nitride semiconductor layer, in each of a region between the gate electrode 11g and the source electrode 11s, and a region between the gate electrode 11g and the drain electrode 11d in a planar view, is lower than the In composition in a region under the gate electrode 11g. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013074188(A) 申请公布日期 2013.04.22
申请号 JP20110213115 申请日期 2011.09.28
申请人 FUJITSU LTD 发明人 KOTANI JUNJI
分类号 H01L21/338;H01L21/20;H01L21/205;H01L21/336;H01L21/76;H01L29/778;H01L29/78;H01L29/812 主分类号 H01L21/338
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