发明名称 SLOT DIE DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a slot die device capable of improving the unevenness of a film thickness of a molten resin discharged from the slot in the width direction. <P>SOLUTION: A heater 15 in contact with a slot die body 2 is structured to slide in the width direction to enable to adjust a temperature distribution. A film thickness measuring device 17 in the way of a transporting a resin film R2 is installed to measure the film thickness of the resin film R2 and a temperature condition to make the film thickness even is estimated to output to a temperature setting device 16 to carry out the temperature control of the heater 15. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013071326(A) 申请公布日期 2013.04.22
申请号 JP20110212419 申请日期 2011.09.28
申请人 TOPPAN PRINTING CO LTD 发明人 OTA SHINJI
分类号 B29C47/16;B29C47/92;B29L7/00 主分类号 B29C47/16
代理机构 代理人
主权项
地址