发明名称 THERMAL CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE COMPOSITION, THERMAL CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE SHEET-LIKE MOLDING, PRODUCTION METHOD OF THEM, AND ELECTRONIC COMPONENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a thermal conductive pressure-sensitive adhesive composition and thermal conductive pressure-sensitive adhesive sheet-like molding, in which reworking is possible just after sticking, and sticking power becomes stronger as time passes, and to provide the production method of the thermal conductive pressure-sensitive adhesive composition and thermal conductive pressure-sensitive adhesive sheet-like molding, and also to provide an electronic component including the thermal conductive pressure-sensitive adhesive composition or the thermal conductive pressure-sensitive adhesive sheet-like molding. <P>SOLUTION: A mixed composition contains: 100 pts.mass of a (meth)acrylic resin composition (A) containing a (meth)acrylic ester polymer (A1) and a (meth)acrylic ester monomer (&alpha;1); 0.3-4 pts.mass of a zinc oxide (C) having an acicular part and 0.1-0.3 g/mL bulk specific gravity; and 600-1,400 pts.mass of an insulating thermal conductive inorganic compound (B) excluding the zinc oxide (C). In the mixed composition, the composition and the molding are obtained by performing: a polymerization reaction of the (meth)acrylic ester monomer (&alpha;1); and a cross-linking reaction of a polymer containing the (meth)acrylic ester polymer (A1) and/or a structural unit derived from the (meth)acrylic ester monomer (&alpha;1). <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013072020(A) 申请公布日期 2013.04.22
申请号 JP20110212722 申请日期 2011.09.28
申请人 NIPPON ZEON CO LTD 发明人 KUMAMOTO TAKURO;KITAGAWA AKIKO
分类号 C09J133/04;C08J5/18;C08K3/22;C08L33/04;C09J7/00;C09J11/04 主分类号 C09J133/04
代理机构 代理人
主权项
地址