| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a component built-in substrate which disperses the stress transmitted from a mother substrate and has superior connectivity with the mother substrate. <P>SOLUTION: In a resin layer 12 of a component built-in substrate 20, a recess 16 is formed on the surface opposite to the surface having a core substrate 6 fixed thereto. When the stress is transmitted from a mother substrate to the component built-in substrate 20, the component built-in substrate 20 becomes easy to bend and the stress is made possible to be dispersed since the resin layer 12 is formed in the recess 16. As a result, the stress applied to external terminals 11 connected to the mother substrate becomes small and bondability between the mother substrate and the component built-in substrate 20 is improved. <P>COPYRIGHT: (C)2013,JPO&INPIT |
