发明名称 FILM FORMING METHOD AND FORMING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a film forming method capable of forming a film having desired characteristics on a plastic substrate using coating printing, and a forming device. <P>SOLUTION: A film forming method comprises a step 1 of manufacturing a member in which a pattern composed of a coating film coated with a coating composition is formed on a plastic substrate and a step 2 of drying and/or modifying the coating film by irradiating the member with ultrasonic waves. This method forms a prescribed film such as a wiring film, an electrode film, or an insulating film used in a device by exerting a chemical action on a coating film being in a solution state. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013074065(A) 申请公布日期 2013.04.22
申请号 JP20110211511 申请日期 2011.09.27
申请人 TOKYO ELECTRON LTD 发明人 SHIMIZU MASAHIRO
分类号 H05K3/10;H01L21/28;H01L21/288;H01L21/31;H01L21/312;H01L21/3205;H01L21/368;H01L21/768 主分类号 H05K3/10
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