发明名称 LASER BEAM MACHINING APPARATUS AND METHOD
摘要 <P>PROBLEM TO BE SOLVED: To perform highly accurate perforation regardless of dust rising. <P>SOLUTION: This laser beam machining apparatus includes: laser beam machining means 11, 13 carrying out perforation by partitioning a machined surface 17 of a printed board 3 by a scan area 22, and by setting positions and a machining direction for every area 22 to emit laser beams 15; and a duct 14 sucking dust 16 rising due to perforating with the laser beam machining means 11, 13. The machining direction (a scanning direction for machining) of laser beams 15 with the laser machining means when carry out machining in the scan area 22 is set to an opposite direction or a perpendicular direction to a rising dust sucking direction. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013071153(A) 申请公布日期 2013.04.22
申请号 JP20110211812 申请日期 2011.09.28
申请人 HITACHI VIA MECHANICS LTD 发明人 TANAKA YOTARO;WATANABE FUMIO
分类号 B23K26/16;B23K26/00;B23K26/38;H05K3/00 主分类号 B23K26/16
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