发明名称 LASER BEAM MACHINE
摘要 <P>PROBLEM TO BE SOLVED: To provide a laser beam machine that can prevent a drop of processing accuracy and expedite operation when a work is holed by a laser beam. <P>SOLUTION: The laser beam machine which cuts a hole on a printed board 4 by a laser beam is provided with a subtable device 3 on a table device. The subtable device 3 has: a levitation device 15 which generates atmospheric pressure between the printed board 4 and the placing face 12a of the subtable plate 12 to levitate the printed board 4; an end top holding device 30 which holds the levitated printed board 4 from the top 4a side; and an aligning device 40 which nips the side face 4b of the printed board 4, whose levitation is suppressed by the end top holding device 30, from the horizontal direction to suppress the printed board 4 from floating/moving for alignment. The drop of processing accuracy can not only be prevented by the effect of debris pooled below by the levitation of the printed board 4 but also the operation process like changing flexible sheets and so on can be reduced to expedite the operation. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013071150(A) 申请公布日期 2013.04.22
申请号 JP20110211631 申请日期 2011.09.27
申请人 HITACHI VIA MECHANICS LTD 发明人 SUZUKI KENJI
分类号 B23K26/10;B23K26/38;H05K3/00 主分类号 B23K26/10
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