发明名称 HOT-MELT ADHESIVE FILM, AND HOT-MELT ADHESIVE FILM LAMINATE
摘要 <P>PROBLEM TO BE SOLVED: To provide a hot-melt adhesive film laminate capable of preventing a hot-melt adhesive composition from being deposited onto a punch and a die in fine and high-speed perforation punching work. <P>SOLUTION: The hot-melt adhesive composition includes a saturated polyester resin, a storage elastic modulus (G') is 1&times;10<SP POS="POST">6</SP>Pa or more to 1&times;10<SP POS="POST">10</SP>Pa in 10-40&deg;C of temperature range, a loss elastic modulus (G") is 1&times;10<SP POS="POST">1</SP>-1&times;10<SP POS="POST">4</SP>Pa in 100-150&deg;C of temperature range, and a thickness is 5-50 &mu;m, in the hot-melt adhesive film laminate. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013072009(A) 申请公布日期 2013.04.22
申请号 JP20110212112 申请日期 2011.09.28
申请人 TORAY IND INC 发明人 NINOMIYA YUICHI;ITO KIYOHIKO
分类号 C09J7/00;B32B27/36;C09J167/00 主分类号 C09J7/00
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