| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing and filling a semiconductor, the composition having high moisture-resistant reliability, suppressing a void under high temperature connecting condition, and responding to a first-supply system that allows formation of a preferable solder bonding part without adding a flux component. <P>SOLUTION: The epoxy resin composition for sealing and filling a semiconductor comprises, as essential components, an epoxy resin, an acid anhydride and a curing accelerator, wherein the acid anhydride is a succinic acid anhydride derivative expressed by general formula (1). A method for manufacturing a semiconductor device and a semiconductor device using the above epoxy resin composition for sealing and filling a semiconductor are also disclosed. In formula (1), R represents an alkenyl group having 3 or more carbon atoms. <P>COPYRIGHT: (C)2013,JPO&INPIT |
