| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic device whose electrodes are electrically connected together by using solder, as in the case of a semiconductor device composed by flip-chip connections, and in which the other parts having the electrodes of electronic components connected thereto can be switched over by a technique other than that which involves changing the circuits of electronic components such as chips or the circuits of wiring boards. <P>SOLUTION: An electronic device (e.g., a semiconductor device 100) includes a wiring board 200 having a plurality of first electrodes 210 on the surface on one side of it and an electronic component (e.g., a chip 300) having a plurality of second electrodes 310 disposed facing each of the plurality of first electrodes 210 on the surface on one side of it. At least one or more of the first electrodes 210 are a specific electrode 220 which is divided into a plurality of divided sections 221 and 222, the divided sections 221 and 222 respectively being connected to different wirings 251 and 252. Either one or more of the divided sections 221 and 222 are connected to the corresponding second electrodes 310 via a solder 110. <P>COPYRIGHT: (C)2013,JPO&INPIT |
