| 摘要 |
PURPOSE: A light emitting device is provided to improve the luminous efficiency of a flip chip type light emitting device and to secure stability and reliability in a mounting process for a light emitting device package. CONSTITUTION: A light emitting structure includes a semiconductor layer(120), a second semiconductor layer, and an active layer. A first electrode(170) is arranged on the semiconductor layer of a first region(B). The area ratio of the first region to a second semiconductor layer is 0.41 to 1. A second electrode(180) is arranged on the second semiconductor layer. The second electrode is connected to the light transparent electrode layer(150).
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