发明名称 CURING AGENT COMPOSITION, RESIN COMPOSITION FOR INSULATING ADHESIVE LAYER, AND METHOD FOR PRODUCING CURING AGENT COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide a curing agent composition excellent in storage stability and capable of forming an insulating adhesive layer high in heat resistance, flexibility, toughness, and electrical properties, to provide a resin composition capable of forming an insulating adhesive layer using the curing agent composition, and to provide a method for producing the curing agent composition. <P>SOLUTION: The curing agent comprises a modified polyvinyl acetal resin consisting essentially of vinyl alcohol structural units, vinyl acetal structural units, methyl acrylate structural units, and vinylamine structural units and an organic solvent. It is preferable that the content of vinyl alcohol structural units is not more than 30 mol%. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013072027(A) 申请公布日期 2013.04.22
申请号 JP20110212983 申请日期 2011.09.28
申请人 SEKISUI CHEM CO LTD 发明人 ISHIKAWA YUKI
分类号 C08L29/14;C08F8/28;C08F216/38;C08G59/40;C09J9/00;C09J11/06;C09J129/14;C09J163/00;H01B3/40;H01B3/42 主分类号 C08L29/14
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