| 摘要 |
<P>PROBLEM TO BE SOLVED: To connect an interconnector to an electrode such as a bus-bar electrode with excellent adhesiveness without soldering. <P>SOLUTION: The laminate comprises: a first electrode conductive layer formed by performing a thermal treatment at a temperature of 400°C or higher on a conductive composition for a first electrode which contains conductive particles (A) such that silver-coated metal powder (a) accounts for 25-100 mass% thereof; and an adhesive conductive layer disposed on the first electrode conductive layer, and formed by a conductive composition for adhesive bonding which contains a binder resin (B) and conductive particles (C). <P>COPYRIGHT: (C)2013,JPO&INPIT |
