| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor chip package and a manufacturing method therefor. <P>SOLUTION: The manufacturing method of a semiconductor chip package utilizing tin plating includes (a) a step for forming a tin-based metal plating layer on a bump pad formed on an IC substrate, (b) a step for forming a Cu filler on the electrode pad of a bare chip, (c) a step for mounting the Cu filler of a bare chip on the metal plating layer of the IC substrate, and then bonding the Cu filler and the metal plating layer, and (d) a step for filling between the IC substrate and the bare chip thus bonded with an insulator. A semiconductor chip package manufactured by that method is also provided. <P>COPYRIGHT: (C)2013,JPO&INPIT |
