| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a soldering flux which can prevent a residue crack and improve surface tackiness of residues after reflow without impairing printability, wettability, and electrical reliability (insulation resistance). <P>SOLUTION: The soldering flux contains synthetic resin, activator, organic solvent, and paraffin wax having a melting point of not lower than 60°C. The paraffin wax is preferable to have constitutional elements of only carbon and hydrogen, at the rate of, for example, 3 to 8 mass% for the amount of flux. Furthermore, the solder paste composition contains this soldering flux and solder alloy powder. <P>COPYRIGHT: (C)2013,JPO&INPIT |
