SEMICONDUCTOR DEVICE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method which can improve manufacturing efficiency and a freedom degree in a manufacturing design of the semiconductor device.

SOLUTION: A manufacturing method of a semiconductor device including a semiconductor chip 5 comprises: a step of preparing the semiconductor chip on which a conductive member 6 is formed on a first principal surface 5A; a step of preparing a supporting structure 10 in which a radiation curable adhesive layer 3 and a first thermosetting resin layer 1 are laminated on a radiotransparent support medium 4 in this order; a step of arranging a plurality of semiconductor chips on the first thermosetting resin layer such that the first thermosetting resin layer and a second principal surface 5b on the opposite side to the first principal surface of the semiconductor chip face each other; a step of laminating a second thermosetting resin layer 2 on the first thermosetting resin layer so as to cover the plurality of semiconductor chips; and a step of detaching the radiation curable adhesive layer and the first thermosetting resin layer by applying radial rays from the support medium side to cure the radiation curable adhesive layer.

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